US Patent # 6469907

The EXT-227 makes both power and signal leads availiable in a transfer molded package.  Some of the particular internal implementation we used is patented. Walt Noll and I did the work covered by this patent for Team Pacific. Team has the capability to design and manufacture standard and custom  electronics packages.  Contact Team Pacific if you're interested in getting product built into this or any other power electronics package.

Packaging for power and other circuitry (link to USPTO)

Abstract

Packaging for power circuitry. A circuit board and a power lead frame are packaged together in a module. In addition to providing electrical connections to power circuitry, the lead frame is employed to fix or partially fix the location of the circuit board in the package. For this purpose, one of the power lead frame and the circuit board includes a male portion and the other of the power lead frame and the circuit board includes a complementary female portion for mechanically coupling the circuit board and the lead frame.